圖10為鋁質抗眩膜模板以PECVD方式披覆DLC膜前後之水滴接觸角變化，由披覆前67∘升至度披覆之99∘。
圖11為模板脫模測試，沒有披覆DLC膜的模板，在與光阻接觸硬化後，便與光阻緊密結合(如圖11(a)圓圈所示)，無法脫模；有披覆DLC膜的模板則可以順利脫模。
4.結論
R2R壓印製程大幅降低軟性顯示器及軟性電子微結構製作成本，但R2R壓印製程要能順利進行，模板與軟性基材的表面處理相當重要，選對處方式才能真正降低成產成本與程製品質。模板表面披覆DLC膜可有效改善模板與硬化光阻之脫模性及圖案轉移率；F-DLC之抗沾粘性與耐用性高於DLC與SAM。電漿對基材表面處理則可以提升光阻於基材附著性及圖案轉移率，陣列型噴射電漿與遠距式DBD電漿不會造成電路及微結構損傷是最適合用來處理軟性顯示器及軟性電子電漿清潔方法。
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